Thứ Ba, 15 tháng 12, 2015

PCB Through-Hole & Copper Surface Measurement Gauge - CMI760


Mr.The Thuc
H/P : (+84)-988983298
Skype: thethuc1
Yahoo: thethuc_ntd
GAUGE SPECIFICATIONS:
 Memory Capacity: 8000 bytes, non-volatile
Dimensions: 11 1/2” (W) x 10 1/2” (D) x 5 1/2” (H) (29.21 x 26.67 x 13.97 cm)
Weight: 6 lbs. (2.79 kg)
Units: Automatic conversion between imperial and metric with a keystroke
Unit Conversions: Select from mils, μm, μin, mm, in., or % as units for display
Output: Parallel printer port and RS232 serial port
Display: Large LCD 480 (H) x 32 (V) pixels, backlit, wide-angle view
Statistical Display: Number of readings, standard deviation, mean, high, low
Charts: Histogram, trend, x-Bar, and r
SRP-4 PROBE SPECIFICATIONS:
Accuracy: ±1% (±0.1 μm) referred to reference standards
Precision: Electroless Copper: 0.2% standard deviation typical, Electrodeposited Copper: 0.3% standard deviation typical
Resolution: 0.01 mils > 1 mil, 0.001 mils < 1 mil, 0.1μm > 10 μm, 0.01 μm < 10 μm, 0.001 μm < 1 μm
Thickness Range: Copper: 10 μin – 10 mil (0.25 μm– 254 μm), Fine Line Measure: trace width 8 mil – 3000 mil (203 μm – 76.2 mm)
ETP PROBE SPECIFICATIONS:
Accuracy: ±0.01 mil (0.25 μm) < 1 mil (25 μm)
Precision: 1.0% at 1.2 mil typical
Resolution: 0.01 mils (0.25 μm)
Eddy Current: Conforms to method ASTM E376
Thickness Range: 0.08– 4.0 mils (1 – 102 μm)
Minimum Hole Size: 35 mils (899 μm)

Thứ Tư, 11 tháng 11, 2015

Coating thickness on ferrous and non-ferrous substrates and structures CMI153 Oxford


Mr.The Thuc
H/P : (+84)-988983298
Skype: thethuc1
Yahoo: thethuc_ntd
Specifications:
• Automatic Substrate Recognition
• No User Calibration Required
• Magnetic Induction: Conforms to methods ASTM B499 & B530, DIN 50981, ISO 2178 and BS 5411 Parts 9 & 11
 •Eddy Current: Conforms to methods ASTM B244 & B529, DIN 50984, ISO 2360 and BS 5411 Part 3
•Factory calibrated, only requires a swift base re-zero correction when measuring on different metallic substrates
Measurement Ranges:
•Ferrous Substrates, Magnetic Induction: 0.001-2.04mm (0.1–80mils)
• Non-ferrous substrates, Eddy Current: 0.001-1.52mm (0.1–60mils)
• Minimum ferrous and non-ferrous substrate thickness: 305µm, 12mils
• Accuracy: ± (2µm + 3% of reading) or ± (0.1mils + 3% of reading)
 Precision:
•Ferrous Substrates, Magnetic Induction: s = 0.8µm (0.03mils) for a 75µm (2.95mils) plastic standard on Steel
 • Non-Ferrous Substrates, Eddy Current: s = 0.5µm (0.02mils) for a 75µm (2.95mils) plastic standard on Al
Dimensions:
• 3.75”x 2”x1”, 9.53cm x 5.08cm x 2.52cm
Weight:
• 2.5 oz (71 g)
Units:
• Automatic conversion between imperial and metric units with a keystroke
Battery:
• 2xAA
• Auto ON/OFF to extend Battery Life

Máy Đo CMI153 Oxford


Mr.The Thuc
H/P : (+84)-988983298
Skype: thethuc1
Yahoo: thethuc_ntd
Specifications:
• Automatic Substrate Recognition
• No User Calibration Required
• Magnetic Induction: Conforms to methods ASTM B499 & B530, DIN 50981, ISO 2178 and BS 5411 Parts 9 & 11
 •Eddy Current: Conforms to methods ASTM B244 & B529, DIN 50984, ISO 2360 and BS 5411 Part 3
•Factory calibrated, only requires a swift base re-zero correction when measuring on different metallic substrates
Measurement Ranges:
•Ferrous Substrates, Magnetic Induction: 0.001-2.04mm (0.1–80mils)
• Non-ferrous substrates, Eddy Current: 0.001-1.52mm (0.1–60mils) • Minimum ferrous and non-ferrous substrate thickness: 305µm, 12mils
• Accuracy: ± (2µm + 3% of reading) or ± (0.1mils + 3% of reading)
 Precision:
•Ferrous Substrates, Magnetic Induction: s = 0.8µm (0.03mils) for a 75µm (2.95mils) plastic standard on Steel
 • Non-Ferrous Substrates, Eddy Current: s = 0.5µm (0.02mils) for a 75µm (2.95mils) plastic standard on Al
Dimensions:
• 3.75”x 2”x1”, 9.53cm x 5.08cm x 2.52cm
Weight:
• 2.5 oz (71 g)
Units:
• Automatic conversion between imperial and metric units with a keystroke
Battery:
• 2xAA
• Auto ON/OFF to extend Battery Life

Thứ Ba, 10 tháng 11, 2015

Máy Đo Đọ Dày Lớp Phủ CMI233 Oxford

Mr.The Thuc
H/P : (+84)-988983298
Skype: thethuc1
Yahoo: thethuc_ntd
Máy đo độ dày lớp phủ
Model:CMI233D
Hãng sản xuất: Oxford-Anh
Thông số kĩ thuật:
Đo được trên mẫu: thép, nhôm, đồng, kẽm.

Đầu dò: Tethered ( Có thể thay thế đầu dò khi bị hỏng ).
Đơn vị đo: mil hoặc µm
Độ sâu:+)  F(0÷120 mil), NF(0÷60 mil)
            +)   F(0÷3,048µm), NF(0÷1,524µm)
Độ chính xác: ±0,05mil + 1%
Độ phân giải: 0,01 mil
Có sử dụng hiệu chuẩn máy
Cung cấp gồm:
Máy chính
Hướng dẫn sử dụng

Copper Plating Thickness Gauge Oxford CMI223D

Mr.The Thuc
H/P : (+84)-988983298
Skype: thethuc1
Yahoo: thethuc_ntd
Máy đo độ dày lớp phủ
Model:CMI233D
Hãng sản xuất: Oxford-Anh
Thông số kĩ thuật:
Đo được trên mẫu: thép, nhôm, đồng, kẽm.

Đầu dò: Tethered ( Có thể thay thế đầu dò khi bị hỏng ).
Đơn vị đo: mil hoặc µm
Độ sâu:+)  F(0÷120 mil), NF(0÷60 mil)
            +)   F(0÷3,048µm), NF(0÷1,524µm)
Độ chính xác: ±0,05mil + 1%
Độ phân giải: 0,01 mil
Có sử dụng hiệu chuẩn máy
Cung cấp gồm:
Máy chính
Hướng dẫn sử dụng